Hệ thống cơ bản mức 2

Basisline Level 2

PCBs like in Level 1
plus green solder mask and blue components printing

    Level 1 additional in 
Level2
Original Bungard
positive presensitized boards
arrow down2
 
CNC-drilling and contour routing
(BUNGARD CCD/2)
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vacuum exposure
(HELLAS)
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dip developing 
+ rinsing
+ sprayetching
+ chemical tinning
+ drying
(all in Splash CENTER)
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mechanical PTH 
(FAVORIT)
 
lamination 
of solder mask

(RLM 419p)
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vacuum exposure of solder mask
(HELLAS)
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spraydeveloping 
of solder mask

(SPLASH D)
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curing of solder mask
(HELLAS or hot air oven)
 

System features:

Like in Level 1, but in addition:

  • Laminator for laminating solder mask and SPLASH D for developing (2 additional machines)
  • Components printing: repeat Laminating, exposure and developing with blue tenting resist.
  • over all process time: 50 to 120min depending on number of holes
  • maximum throughput: 6m² / 8 h
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