PCBs like in Level 2
in addition with negative resist and galvanic plating through hole
Level 1 + 2 | additional in Level 3 |
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raw material cut to size (Ne-Cut) |
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CNC-drilling and contour routing (BUNGARD CCD/2) |
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brushcleaning (RBM 300) |
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galvanic plating through hole (COMPACTA 30) |
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brushcleaning (RBM 300) |
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lamination of tenting resist (RLM 419p) |
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vacuum exposure (HELLAS) |
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spray developing (SPLASH D) |
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spray etching |
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brushcleaning |
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chemical tinning |
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lamination |
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exposure of solder mask (HELLAS) |
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spray developing (SPLASH D) |
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curing of solder mask (HELLAS or hot air oven) |
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CNC-V-cut or contour routing (Bungard CCD/2) |
System features: