PCB prouction with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing like Basisline Level 3, but optimized on through put!

	raw material cut to size (Ne-Cut)
	CNC-drilling and  contour routing (BUNGARD CCD/ATC)
	brushcleaning  (RBM 300)
	galvanic plating  through hole (COMPACTA 30 2CU)
	brushcleaning  (RBM 300)
	lamination  of tenting resist (RLM 419p #1)
	vacuum exposure (HELLAS)
	spray developing  (SPLASH D)
	spray etching stripping of tenting resist (SPLASH CENTER)
	brushcleaning  (RBM 300)
	chemical tinning (SPLASH CENTER)
	lamination  of solder mask (RLM 419p #2)
	exposure of solder mask (HELLAS)
	spray developing  (SPLASH D)
	curing of solder mask (HELLAS or hot air oven)
	CNC-V-cut or contour routing  (Bungard CCD/ATC)

System features:

• CCD/ATC for enhanced drilling, COMPACTA 30 2 CU doubles galvanic throughput, a second laminator RLM 419p avoids changing rolls between the steps!
• Fine-line technology in industrial quality with green solder mask and blue components printing!
• (To make components printing repeat again from laminating but with RLM 419p #1 and blue tenting resist)
• Modular upgradeable to multilayer, artwork production, waste water treatment or surface finishing set at any time !
• Track resolution: better 150µm!
• Film production with laser printer or bubble jet or local film supplier.
• Processing time: approx. 2 hours
• maximum throughput: 2,0m² / 8h – more than twice the volume of Basisline 3!
• maximum usable size: 210 x 300 mm