PCB production with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing like Basisline Level 3, but optimized on through put for
raw material cut to size (Ne-Cut) |
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CNC-drilling and contour routing (BUNGARD CCD/ATC) |
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brushcleaning (RBM 300) |
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galvanic plating through hole (COMPACTA 40 2CU) |
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brushcleaning (RBM 300) |
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lamination of tenting resist (RLM 419p #1) |
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vacuum exposure (HELLAS) |
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spray developing (SPLASH XL) |
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spray etching |
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brushcleaning |
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chemical tinning |
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lamination |
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exposure of solder mask (HELLAS) |
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spray developing (SPLASH XL) |
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curing of solder mask (HELLAS or hot air oven) |
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CNC-V-cut or contour routing (Bungard CCD/ATC) |
System features: