PCB production with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing like Basisline Level 3, but optimized on through put for
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raw material cut to size (Ne-Cut) ![]() |
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CNC-drilling and contour routing (BUNGARD CCD/ATC) ![]() |
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brushcleaning (RBM 300) ![]() |
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galvanic plating through hole (COMPACTA 40 2CU) ![]() |
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brushcleaning (RBM 300) ![]() |
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lamination of tenting resist (RLM 419p #1) ![]() |
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vacuum exposure (HELLAS) ![]() |
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spray developing (SPLASH XL) ![]() |
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spray etching |
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brushcleaning |
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chemical tinning |
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lamination |
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exposure of solder mask (HELLAS) ![]() |
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spray developing (SPLASH XL) ![]() |
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curing of solder mask (HELLAS or hot air oven) ![]() |
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CNC-V-cut or contour routing (Bungard CCD/ATC) |
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System features: