PCB production with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing like Basisline Level 3, but optimized on through put for 

board size 300 x 400mm!

	raw material cut to size (Ne-Cut)
	CNC-drilling and  contour routing (BUNGARD CCD/ATC)
	brushcleaning  (RBM 300)
	galvanic plating  through hole (COMPACTA 40 2CU)
	brushcleaning  (RBM 300)
	lamination  of tenting resist (RLM 419p #1)
	vacuum exposure (HELLAS)
	spray developing  (SPLASH XL)
	spray etching stripping of tenting resist (SPLASH CENTER XL)
	brushcleaning  (RBM 300)
	chemical tinning (SPLASH CENTER XL)
	lamination  of solder mask (RLM 419p #2)
	exposure of solder mask (HELLAS)
	spray developing  (SPLASH XL)
	curing of solder mask (HELLAS or hot air oven)
	CNC-V-cut or contour routing  (Bungard CCD/ATC)

System features:

• CCD/ATC for enhanced drilling, COMPACTA 40 2 CU doubles galvanic throughput, a second laminator RLM 419p avoids changing rolls between the steps!
• maximum usable size: 300 x 400mm because of COMPACTA 40 2CU, SPLASH XL and SPLASH CENTER XL!
• Fine-line technology in industrial quality with green solder mask and blue components printing!
• (To make components printing repeat again from laminating but with RLM 419p #1 and blue tenting resist)
• Modular upgradeable to multilayer, artwork production, waste water treatment or surface finishing set at any time!
• Track resolution: better 150µm!
• Leiterbahnenauflösung: besser als 150μm
• Film production with laser printer or bubble jet or local film supplier.
• Processing time: approx. 2 hours
• maximum throughput: 3,0m² / 8h – approx. three times the volume of Basisline 3!