Preparation part 1 artwork production |
Preparation part 2 |
PCB standard process |
precut films |
Cut raw material to size (Ne-Cut) ![]() CNC-drilling of reference holes on innerlayers, prepregs + top/bottom layers (BUNGARD CCD) ![]() brushcleaning of inner layers (RBM 402KF/RBM 300) ![]() laminating of etch resist (RLM 419p) ![]() vacuumexposure (EXP 8000/HELLAS) ![]() spraydeveloping (DL500/SPLASH) ![]() sprayetching (DL 500/SPLASH CENTER) ![]() stripping of etchresist (DL 500S/SPLASH CENTER) ![]() brushcleaning (RBM 402KF/RBM 300) ![]() insert reference pins (Favorit) ![]() mulitlayer press lamination (RMP 210) |
CNC-drilling (BUNGARD CCD) ![]() brushcleaning (RBM 402KF/RBM 300) ![]() galvanic PTH (COMPACTA) ![]() brushcleaning (RBM 402KF/RBM 300) ![]() lamination of etch resist (RLM 419p) ![]() vacuum exposure (EXP 8000/HELLAS) ![]() spray developing (DL 500/SPLASH) ![]() spray etching (DL 500/SPLASH CENTER) ![]() stripping of etch resist (DL 500S/SPLASH CENTER) ![]() brush cleaning (RBM 402KF/RBM 300) ![]() chemical tinning (EG 01/SPLASH CENTER) ![]() lamination of solder mask (RLM 419p) ![]() exposure of solder mask (EXP 8000/HELLAS) ![]() spray developing (DL 500/SPLASH) ![]() curing of soldermask (EXP 8000/HELLAS/hot air oven) ![]() CNC-V-cut or CNC-routing (BUNGARD CCD) |