Preparation part 1 artwork production |
Preparation part 2 |
PCB standard process |
precut films |
Cut raw material to size (Ne-Cut) CNC-drilling of reference holes on innerlayers, prepregs + top/bottom layers (BUNGARD CCD) brushcleaning of inner layers (RBM 402KF/RBM 300) laminating of etch resist (RLM 419p) vacuumexposure (EXP 8000/HELLAS) spraydeveloping (DL500/SPLASH) sprayetching (DL 500/SPLASH CENTER) stripping of etchresist (DL 500S/SPLASH CENTER) brushcleaning (RBM 402KF/RBM 300) insert reference pins (Favorit) mulitlayer press lamination (RMP 210) |
CNC-drilling (BUNGARD CCD) brushcleaning (RBM 402KF/RBM 300) galvanic PTH (COMPACTA) brushcleaning (RBM 402KF/RBM 300) lamination of etch resist (RLM 419p) vacuum exposure (EXP 8000/HELLAS) spray developing (DL 500/SPLASH) spray etching (DL 500/SPLASH CENTER) stripping of etch resist (DL 500S/SPLASH CENTER) brush cleaning (RBM 402KF/RBM 300) chemical tinning (EG 01/SPLASH CENTER) lamination of solder mask (RLM 419p) exposure of solder mask (EXP 8000/HELLAS) spray developing (DL 500/SPLASH) curing of soldermask (EXP 8000/HELLAS/hot air oven) CNC-V-cut or CNC-routing (BUNGARD CCD) |