Chemical Nickel-Gold (Enig = electroless nickel gold)

Since early 1990s the alloy surface (nickel / phosphorus & gold) is one of the most versatile surfaces. In this method, a nickel layer forms the diffusion barrier between copper and solder alloy. The gold is dissolved in the solder joint and the liability / IMC formation is done with the nickel layer. Electroless nickel-gold requires an upstream copper activation to start the nickel deposition. The nickel layer increases mechanical vias and increases the abrasion resistance.

Layer properties:

• low / medium / high P systems (<7, 7-10;> 10% P)
• Layerthickness 3 - 6μm NiP and 0.05-0.12μm Au
• Autocatalytic nickel deposition
• Gold protects nickel from oxidation
• Reliable multi-functional surface
• suitable for Al-wire bonding
• Growth of the nickel-phosphorus layer of activated copper

Advantages: 

• Suitable for multiple Pb-free soldering
• Planarity for SMT
• Diffusion barrier (nickel), prevents the solution of copper in the solder
• Long storage time (12 months), excellent resistance against ageing
• E-Test Compatible
• Suitable for contact switches
• Good resistance in corrosive environments
• Suitable for AL-wire bonding
• Suitable for high aspect ratio boards

Equipment: 
Compacta 30 chem. Nickel-Gold 
This machine can perform nickel and gold plating for printed circuit boards up to a size of 200x300mm. 5 PVC tanks, 2 PP tanks all about 10 liters, 3 Teflon radiators all with thermostatic, 5 Digital Timer, bath movement (adjustable), all tanks with ball valve drain. spray rinse with foot switch, flushing pressure adjustable. Stand-alone machine. Connection: 230 V

Options: 
Compacta 40 chem. Nickel-gold,
Nickel and gold plating plant for printed circuit boards up to a size of 300 x 400mm.

further links:

-> Compacta 30

-> Compacta 40

-> Favorit

-> Compacta Ni-Au

-> Protec
-> Accessories