410 W Rework station with IR under-heating system (80 x 60 mm²) and automated SMD placement process by Auto Vision Placer (AVP) incl. software EASYSOLDER 07 and DBL 06 control unit with six high-resolution sensors inputs for thermocouples (Type K). This unit is particularly suitable for small PCBs found in smartphones and PDAs with fine-pitch components in varying package dimensions.
| DB00.1068 | EXPERT 10.6 IV | x 1 | auf Anfrage |
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Power consumption: |
1000 VA | |
| Power solder pen: | 300 W, 35 l/min | |
| Power under-heating system: | 110 W, 2 x IR-lamps | |
| Size under-heating system: | 80 x 60 mm² | |
| Max. PCB size: | 100 x 80 mm² | |
| Resolution motion system: | 0,001 mm | |
| Placement accuracy: | ± 0,015 mm | (Flip Chip)* |
| ± 0,030 mm | (CSP) | |
| ± 0,040 mm | (BGA) | |
| High resolution CMOS-camera: | 5 Mio. Pixel, USB2 | |
| Camera field of view (FOV): | 14 x 18 mm² | (Flip Chip)* |
| 28 x 37 mm² | (CSP) | |
| 37 x 50 mm² | (BGA) | |
| Mains: | 1 Phase, 230VAC, Fuse 16A | |
| Pressurized air: | 5-8 bar, 100 l/min | clean, dry air |
| Dimensions: | 865 x 460 mm² | |
| * Optional extras | ||
| Device flyer | 1.2 MB | Download |
| SF64.0501 | Tool Shuttle 32mm | x 1 | auf Anfrage |
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SF64.0525 | Dip Tool 0.08mm with squeegee | x 1 | auf Anfrage |
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SF64.0526 | Dip Tool 0.15mm with squeegee | x 1 | auf Anfrage |
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| SF64.0527 | Dip Tool 0.22mm with squeegee | x 1 | auf Anfrage |
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| SF64.0520 | Print Tool with squeegee | x 1 | auf Anfrage |
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