Expert 10.6 IV
410 W Rework station with IR under-heating system (80 x 60 mm²) and automated SMD placement process by Auto Vision Placer (AVP) incl. software EASYSOLDER 07 and DBL 06 control unit with six high-resolution sensors inputs for thermocouples (Type K). This unit is particularly suitable for small PCBs found in smartphones and PDAs with fine-pitch components in varying package dimensions.
Product variants in the shop
Content
Tool set for dispensing, placing, residual solder removal and soldering with magazine
Set of placement nozzles (BGA/CSP) 3 mm, 5 mm, 8 mm, 10 mm
Set of soldering nozzles (CSP/QFN), 9 mm, 11 mm 13 mm, 16 mm
Set of soldering nozzles (SO) 10x15 mm², 15x25 mm²
Placement nozzle for manual placement of small components (0,5 mm)
Two camera lenses (BGA und CSP)
Two thermocouple sensors (type K)
Two PCB magnet holder 40.5 mm (standard)
PCB support rail 40.5 mm
Two PCB clips to install at hand rest
Foot switch
Rework ABC and manual
Intuitive software EASYSOLDER 07 with touch integration
Technical details
Power consumption:
1000 VA
Power solder pen:
300 W, 35 l/min
Power under-heating system:
110 W, 2 x IR-lamps
Size under-heating system:
80 x 60 mm²
Max. PCB size:
100 x 80 mm²
Resolution motion system:
0,001 mm
Placement accuracy:
± 0,015 mm
(Flip Chip)*
± 0,030 mm
(CSP)
± 0,040 mm
(BGA)
High resolution CMOS-camera:
5 Mio. Pixel, USB2
Camera field of view (FOV):
14 x 18 mm²
(Flip Chip)*
28 x 37 mm²
(CSP)
37 x 50 mm²
(BGA)
Mains:
1 Phase, 230VAC, Fuse 16A
Pressurized air:
5-8 bar, 100 l/min
clean, dry air
Dimensions:
865 x 460 mm²
* Optional extras
Downloads
modules & attachments
SF64.0501
Tool Shuttle 32mm
1 2 3 4 5 6 7 8 9 10
x 1
auf Anfrage
SF64.0525
Dip Tool 0.08mm with squeegee
1 2 3 4 5 6 7 8 9 10
x 1
auf Anfrage
SF64.0526
Dip Tool 0.15mm with squeegee
1 2 3 4 5 6 7 8 9 10
x 1
auf Anfrage
SF64.0527
Dip Tool 0.22mm with squeegee
1 2 3 4 5 6 7 8 9 10
x 1
auf Anfrage
SF64.0520
Print Tool with squeegee
1 2 3 4 5 6 7 8 9 10
x 1
auf Anfrage