• Gợi ý từ khóa:
  • maitek, bungard, CCD2, CCD ATC, CCD MTC, SMT, PCB

Martin

Hệ thống sửa chữa bo mạch Martin EXPERT 10.6 HV

Mã sản phẩm: Chưa rõ
Liên hệ

Chính sách

Giao hàng toàn quốc

Bảo hành 12 tháng theo tiêu chuẩn nhà sản xuất

Cam kết

Hàng mới 100%, chính hãng sản xuất.

Cung cấp đầy đủ chứng từ, hóa đơn, CO, CQ theo yêu cầu

Giao hàng miễn phí toàn quốc với đơn hàng >10 triệu

Hỗ trợ tư vấn, kỹ thuật 24/7

Chính sách bảo hành tiêu chuẩn và gia hạn bảo hành theo yêu cầu.

Chi tiết sản phẩm

EXPERT 10.6 HV

Rework Station with 3,300W hybrid under heater. The heating area of 275 x 245 mm² is adjustable to PCB size. Automated SMD placement process by Auto Vision Placer (AVP) incl. EASYSOLDER software package and DBL 06 control unit with six high resolution sensors inputs for thermocouples (Type K). This system is particularly suitable for mid-size and large PCBs with fine-pitch components of varying package dimensions.

Product variants in the shop

expert-10.6-HV-perspective01

DB00.1065 EXPERT 10.6 HV

x 1 auf Anfrage

Content

  • Tool set for dispensing, placing, residual solder removal and soldering with magazine
  • Set of placement nozzles (BGA/CSP) 3 mm, 5 mm, 8 mm, 10 mm
  • Set of solder nozzles (BGA) 15 mm, 27 mm, 35 mm, 40 mm
  • Two camera lenses (BGA und CSP)
  • Two thermocouple sensors (type K)
  • Four PCB magnet holder 40,5 mm (standard)
  • Two PCB clips to install at hand rest
  • Foot switch
  • Rework ABC and manual
  • Intuitive software EASYSOLDER 07 with touch integration

Technical details

Power consumption: 3,500 VA  
Power solder pen: 300 W, 35 l/min  
Power under-heating system: 600-3,000 W 6 x IR-lamps
Size under-heating system: 275 x 245 mm²  
Max. PCB size: 305 x 305 mm²  
Resolution motion system: 0,001 mm  
 
Placement accuracy: ± 0,015 mm (Flip Chip)*
  ± 0,030 mm (CSP)
  ± 0,040 mm (BGA)
  ± 0,070 mm (Maxi BGA)*
  ± 0,115 mm

 (Maxi BGA XL)*

 
High resolution CMOS-camera: 5 Mio. Pixel,USB2  
Camera field of view (FOV): 14 x 18 mm² (Flip Chip)*
  28 x 37 mm² (CSP)
  37 x 50 mm² (BGA)
  65 x 85 mm² (Maxi BGA)*
 

115 x 160mm²

(Maxi BGA XL)*

 
Mains: 1Phase, 230VAC, Fuse 16A Connector Type CEE 32A (3 phase)
Pressurized air: 5-8 bar, 100 l/min clean, dry air
Dimensions: 865 x 460 mm²  
 
    * Optional extras

Downloads

Device flyer 1.1 MB  Download

modules & attachments

APP TOOL Slider2721

SF64.0501 Tool Shuttle 32mm

x 1 auf Anfrage

martin-image-placeholder

SF64.0525 Dip Tool 0.08mm with squeegee

x 1 auf Anfrage

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SF64.0526 Dip Tool 0.15mm with squeegee

x 1 auf Anfrage

Martin-1200-Dip Tool 0.22mm with squeegee

SF64.0527 Dip Tool 0.22mm with squeegee

x 1 auf Anfrage

Martin-1200-Print Tool with squeegee for tool shuttle 32, 40

SF64.0520 Print Tool with squeegee

x 1 auf Anfrage

CÔNG TY TNHH CÔNG NGHỆ MAITEK VIỆT NAM
CÔNG TY TNHH CÔNG NGHỆ MAITEK VIỆT NAM