Rework Station with 3,300W hybrid under heater. The heating area of 275 x 245 mm² is adjustable to PCB size. Automated SMD placement process by Auto Vision Placer (AVP) incl. EASYSOLDER software package and DBL 06 control unit with six high resolution sensors inputs for thermocouples (Type K). This system is particularly suitable for mid-size and large PCBs with fine-pitch components of varying package dimensions.
DB00.1065 | EXPERT 10.6 HV | x 1 | auf Anfrage |
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Power consumption: | 3,500 VA | |
Power solder pen: | 300 W, 35 l/min | |
Power under-heating system: | 600-3,000 W | 6 x IR-lamps |
Size under-heating system: | 275 x 245 mm² | |
Max. PCB size: | 305 x 305 mm² | |
Resolution motion system: | 0,001 mm | |
Placement accuracy: | ± 0,015 mm | (Flip Chip)* |
± 0,030 mm | (CSP) | |
± 0,040 mm | (BGA) | |
± 0,070 mm | (Maxi BGA)* | |
± 0,115 mm |
(Maxi BGA XL)* |
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High resolution CMOS-camera: | 5 Mio. Pixel,USB2 | |
Camera field of view (FOV): | 14 x 18 mm² | (Flip Chip)* |
28 x 37 mm² | (CSP) | |
37 x 50 mm² | (BGA) | |
65 x 85 mm² | (Maxi BGA)* | |
115 x 160mm² |
(Maxi BGA XL)* |
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Mains: | 1Phase, 230VAC, Fuse 16A | Connector Type CEE 32A (3 phase) |
Pressurized air: | 5-8 bar, 100 l/min | clean, dry air |
Dimensions: | 865 x 460 mm² | |
* Optional extras |
Device flyer | 1.1 MB | Download |
SF64.0501 | Tool Shuttle 32mm | x 1 | auf Anfrage |
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SF64.0525 | Dip Tool 0.08mm with squeegee | x 1 | auf Anfrage |
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SF64.0526 | Dip Tool 0.15mm with squeegee | x 1 | auf Anfrage |
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SF64.0527 | Dip Tool 0.22mm with squeegee | x 1 | auf Anfrage |
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SF64.0520 | Print Tool with squeegee | x 1 | auf Anfrage |
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