Rework Station with 5,300 W hybrid under-heating system. The heating area of 450 x 420 mm2 is adjustable to PCB size. Automated SMD placement process by Auto Vision Placer (AVP) incl. EASYSOLDER 07 software package and DBL 06 control unit with six high resolution sensors inputs for thermocouples (Type K).
This system is particularly suitable for large size PCBs like PCs, Laptops and Server Boards with small up to very big components.
DB00.1066 | EXPERT 10.6 HXV | x 1 | auf Anfrage |
|
Power consumption: | 5,500 VA | |
Power solder pen: | 300 W, 35 l/min | |
Power under-heating system: | 1200 - 5000 W | 8 x IR-lamps |
Size under-heating system: | 450 x 420 mm2 | |
Max. PCB size: | 480 x 480 mm2 | |
Resolution motion system: | 0,001 mm | |
Placement accuracy: | ± 0,015 mm | (Flip Chip)* |
± 0,030 mm | (CSP) | |
± 0,040 mm | (BGA) | |
± 0,070 mm | (Maxi BGA)* | |
± 0,115mm |
(Maxi BGA XL)* |
|
High resolution CMOS-camera: | 5 Mio. Pixel USB2 | |
Camera field of view (FOV): | 16 x 22 mm2 | (Flip Chip)* |
32 x 42 mm2 | (CSP) | |
42 x 57 mm2 | (BGA) | |
71 x 96 mm2 | (Maxi BGA)* | |
115 x 160mm² |
(Maxi BGA XL)* |
|
Mains: | 1Phase, 230VAC, fused 16A | Stecker Typ CEE 32A (3-phasig) |
Pressurized air: | 5-8 bar, 100 l/min, | clean, dry air |
Dimensions: | 1030 x 630 mm2 | |
* Optional extras |
Device flyer | 0.9 MB | Download |
SF66.0501 | Tool Shuttle 40mm | x 1 | auf Anfrage |
|
|||
SF64.0525 | Dip Tool 0.08mm with squeegee | x 1 | auf Anfrage |
|
|||
SF64.0526 | Dip Tool 0.15mm with squeegee | x 1 | auf Anfrage |
|
|||
SF64.0527 | Dip Tool 0.22mm with squeegee | x 1 | auf Anfrage |
|
|||
SF66.0526 | Dip Tool 0.15mm with squeegee | x 1 | auf Anfrage |
|