• Gợi ý từ khóa:
  • maitek, bungard, CCD2, CCD ATC, CCD MTC, SMT, PCB

Martin

Hệ thống sửa chữa bo mạch Martin EXPERT 10.6 HXV

Mã sản phẩm: Chưa rõ
Liên hệ

Chính sách

Giao hàng toàn quốc

Bảo hành 12 tháng theo tiêu chuẩn nhà sản xuất

Cam kết

Hàng mới 100%, chính hãng sản xuất.

Cung cấp đầy đủ chứng từ, hóa đơn, CO, CQ theo yêu cầu

Giao hàng miễn phí toàn quốc với đơn hàng >10 triệu

Hỗ trợ tư vấn, kỹ thuật 24/7

Chính sách bảo hành tiêu chuẩn và gia hạn bảo hành theo yêu cầu.

Chi tiết sản phẩm

EXPERT 10.6 HXV

Rework Station with 5,300 W hybrid under-heating system. The heating area of 450 x 420 mm2 is adjustable to PCB size. Automated SMD placement process by Auto Vision Placer (AVP) incl. EASYSOLDER 07 software package and DBL 06 control unit with six high resolution sensors inputs for thermocouples (Type K).

This system is particularly suitable for large size PCBs like PCs, Laptops and Server Boards with small up to very big components.

Product variants in the shop

expert-10.6-HXV-perspective01

DB00.1066 EXPERT 10.6 HXV

x 1 auf Anfrage

Content

  • Tool set for dispensing, placing, residual solder removal and soldering with magazine
  • Set of placement nozzles XL-type (BGA/CSP) 5 mm, 8 mm, 15 mm with O-Ring
  • Set of solder nozzles (BGA) 15 mm, 27 mm, 35 mm, 40 mm
  • Two camera lenses (BGA und CSP)
  • Two thermocouple sensors (type K)
  • Six PCB magnet holder 40,5 mm (3x standard, 3x Easy Lock)
  • Three PCB clips to install at hand rest
  • Foot switch
  • Rework ABC and manual
  • Intuitive software EASYSOLDER 07 with touch integration

Technical details

Power consumption: 5,500 VA  
Power solder pen: 300 W, 35 l/min  
Power under-heating system: 1200 - 5000 W 8 x IR-lamps
Size under-heating system: 450 x 420 mm2  
Max. PCB size: 480 x 480 mm2  
Resolution motion system: 0,001 mm  
     
Placement accuracy: ± 0,015 mm (Flip Chip)*
  ± 0,030 mm (CSP)
  ± 0,040 mm (BGA)
  ± 0,070 mm (Maxi BGA)*
 

± 0,115mm

(Maxi BGA XL)*

 
High resolution CMOS-camera: 5 Mio. Pixel USB2  
Camera field of view (FOV): 16 x 22 mm2 (Flip Chip)*
  32 x 42 mm2 (CSP)
  42 x 57 mm2 (BGA)
  71 x 96 mm2 (Maxi BGA)*
 

115 x 160mm²

(Maxi BGA XL)*

 
Mains: 1Phase, 230VAC, fused 16A Stecker Typ CEE 32A (3-phasig)
 
Pressurized air: 5-8 bar, 100 l/min, clean, dry air
 
Dimensions: 1030 x 630 mm2  
 
    * Optional extras

Downloads

Device flyer 0.9 MB  Download

modules & attachments

APP TOOL Slider2721

SF66.0501 Tool Shuttle 40mm

x 1 auf Anfrage

martin-image-placeholder

SF64.0525 Dip Tool 0.08mm with squeegee

x 1 auf Anfrage

martin-image-placeholder

SF64.0526 Dip Tool 0.15mm with squeegee

x 1 auf Anfrage

Martin-1200-Dip Tool 0.22mm with squeegee

SF64.0527 Dip Tool 0.22mm with squeegee

x 1 auf Anfrage

martin-image-placeholder

SF66.0526 Dip Tool 0.15mm with squeegee

x 1 auf Anfrage

CÔNG TY TNHH CÔNG NGHỆ MAITEK VIỆT NAM
CÔNG TY TNHH CÔNG NGHỆ MAITEK VIỆT NAM