FRITSCH offers with the reflow solder system the optimal solution for the production of small up to medium series. The reflow ovens guarantee an environment-friendly lead-free soldering of highest component diversity incl. QFP, BGA/CSP etc. FRITSCH talks about two Systems which are nearly identic. The main difference between the 551.19 and the 551.10 is the active chamber length. The reflow oven 551.19 has a length up to2125 mm and a usable working width of 405 mm and the 551.10 a length of 850 mm. Both systems are controlled by a user-friendly software which can be fitted to the demands of the solder project.
There are various stand-alone or inline reflow solder systems with the established heating system available for leaded or lead-free soldering and glue-hardening. Temperature sensors record profiles of components and analyse them. Several measuring instruments enlarge the offering.
Reflow Solder System Details
The reflow oven affords non-polluting, lead free soldering of complex boards with components like QFP, BGA/CSP... Small and medium series are the optimal application for the oven.
The basic machine is disposes of a heating chamber with eight heating zones, in each case four on the top and bottom. The heating zones emit convective heat with the help of hot air blower.
The upper part of the heating chamber includes additional a cooling zone and an exhaust air bonnet in the lead-in and lead-out-area. A grid belt transports the soldering manor.
The soldering system is handled by a modern 7" touch panel. An one-channel temperature sensor is integrated for controlling the contour of soldering on the PCB. An equal thermoelement sensor is in the scope of delivery.