Máy hàn chip set BGA bằng tay ZM-R6808

Main Features:

1.  Adopt linear slide which makes X, Y, Z axis all can do micro adjust or rapid positioning, with high precision, within ±0.01MM, easy operation.

2.  3 independent heaters area. The 1st and 2nd hot-air heaters can set multiple groups and segments temperature parameters. The 2nd heater can move up and down. The 3rd large area IR heater can preheat the PCB board fully to ensure no deformation to the board.

3. High-precision K-type thermocouple with closed loop control, PID auto-tuning temperature system, combined with highly sensitive temperature module for the precise temperature control, the temperature error controlled within ± 2 degree

4. The external sensor can detect temperature precisely, analyze and calibrate the real temperature curve accurately.

5. V-groove, Flexible and removable universal fixture has protective effects and no damage to the PCB board, suitable for all kinds of BGA repair.

6. Alloy BGA nozzles, 360 degree rotation, easy to install and replace, customized is available

7.  Laser positioning function is optional; with High-definition CCD color optical vision system

8. You can clearly observe all aspects of the BGA chip through the Optical lens moving freely and manually. Equipped with 15 inch TFT LCD Monitor.

9. CE certification, ensure the quality.  

10. After finishing desoldering and soldering, there is alarming horn .When temperature goes out of control, the circuit will automatically power off.

11..powerful cross-flow fan to cool the PCB board automatically after desoldering and soldering, it can prevent the deformation of PCB board to ensure the welding effect.

12. Human-machine interface which is high-definition touch screen (Taiwan) with password protection, “set up” and "operation” interfaces.

It can save multiple profiles; you can set, analyze and calibrate the temperature parameters curve on the screen at any time. Temperature, time, slope, cooling, alarming all can be displayed on the touch screen.

13. It can rework all the bga chip of laptop, mobile, xbox360 and PS serials and other components.  

1

Total Power

4850W

2

Top heater

800W

3

Bottom heater

2nd  heater 1200W，3rdIR heater 2700W

4

power

AC220V±10％     50/60Hz

5

Machine Dimensions

L850*W830*H800 mm

6

Positioning

V-groove, PCB support can be adjusted in any direction and with external universal fixture

7

Temperature control

K-type thermocouple (Closed Loop), heating independently, temperature precision within ±2 degree

8

PCB size

Max 370*450 mm      Min 22*22 mm

9

Electrical materials

Taiwantouch screen+ PLC+ heating plate(Germany)+high precision intelligent temperature control module

10

Camera magnification

10-100×

11

Optical system

CCD color high-definition imaging system, manually

12

BGA chip

1×1-80×80mm

13

Touch screen

7.0 inch ,Resolution 640X480, Panel Visa touch screen, external USB interface

14

External temperature sensor

One(optional)

15

Placement Accuracy

X, Y axis and the R angle with micrometer adjust, accuracy within ±0.01MM

16

Net weight

75kg