Name: in-line 3D Solder Paste Inspection
Model: InSPIre-510C
Specifications: monorail
Size: 450 x450 mm (Detection area)
Inspection Principle: Sine white projection PMP inspection
Inspection type:Volume, area, height, XY offset, shape, etc.
Detection of defect Types:shift, excessive solder, insufficient solder, offset, deformed shape, etc.
Smallest component size: 008004.
XY positioning accuracy:1um Grating ruler.
Repeatability: height:≤1um (4 Sigma);volume/acreage:<1%(4 Sigma).
Maximum Loading PCB Size(X*Y): 450x450mm.
Inspection Speed: 0.3 SEC/FOV.
Fiducial mark Detection Time: 0.5sec/piece.
Maximum inspection component height:±550um (±1200umOption).
High precision industrial camera with high frame count.
RGB Tune patented technology.
D-lighting patented technology.
Dynamic copying function and static anti-warping function.
Barcode function with traceability .
Badmark function with mounters.
Closed loop function with printer
Access IMS system functions.
Operating System Support: Windows 10 Professional (64 bit).
Five-minute programming, one-click operation.
SPC process control.