Máy kiểm tra X ray X6600

Application                                           

Surface mount device

Electronic component

Plastic Products

PCBA solder joint detection (BGA, CSP, POP, QFN and other components)

Standard Configuration：

Object Stage Control                                               
1. by the spacebar to adjust stage speed: slow, constant and fast speed
2. Keyboard control X, Y, Z three-axis motion and inclined angle 
3. The user can control the stage speed and angle programmatically

4.Large navigation window, easy to locate and identify defective products
5.Click on the mouse to controlled stage

6.Visual screen with floating button

7.through mouse control stage in the Visual screen

Full Automatic BGA Testing Procedures                                  
1. A simple mouse click programming without the need for operator intervention on the component can detects each BGA automatically.
2. Automatic BGA test, accurately check the bridge, Welding, cold welding and void ratio of BGA.
3. Automatic BGA test repeatable test results in order to process control
4. The test results will be displayed on the screen and can be output  to Excel to facilitate review and archiving

NC Programming                                          
1.A simple mouse clicks operation write test procedures
2.The stage can be X, Y director positioning; X-ray tube and detector Z positioning.
3.Software setting voltage and current
4.Image settings: brightness, contrast, auto gain and exposure
5.The user can set the program switch pause time

6.Anti-collision system can meet the maximum tilt and observe objects

7.Automatic analysis of BGA diameter, void ratio, area and roundness

Typical X-Ray Applications

1> 2D imaging

2> Color image

3>Circuit Board Inspection.Circuit board testing automated testing of BGA welding area, bubbles and air (Open), short circuits, offset, round, Tin lost the ball.

Bridging, standard BGA bridge (cause: solder paste too much solution: check the press machine)

Cold Solder, Standard BGA Cold Welding (Possible Cause: No Melting Temperature Solution: Check Reflow )

Check the solder paste, BGA open (Possible reasons: solder printing problems, solder missing, poor solderability. Solution: Check the press)

4>Semi-Conductor,Internal wire bonding inspecetion

5>Inspection ofinternal part of a capacitor.

6> Lithium battery detection.Measuring the distance between the cathode and cathode of the lithium battery

7>Detection of electric heating tube

Check the quality of the resistance wire inside the heating tube

8>  Detection of automobile tubing

Detection the cracks inside the tubing, cracks, damage