Máy kiểm tra Xray X5600

Application                                               
Cell phone motherboard

laptop motherboard

LED lamp beads

Electronic components

Packaged components

Earphone module

Full Automatic BGA Testing Procedures                                

1. A simple mouse click programming without the need for operator intervention on the component can detects each BGA automatically.
2. Automatic BGA test, accurately check the bridge, Welding, cold welding and void ratio of BGA.
3. Automatic BGA test repeatable test results in order to process control
4. The test results will be displayed on the screen and can be output  to Excel to facilitate review and archiving
 

NC Programming                                        
1.A simple mouse clicks operation write test procedures
2.The stage can be X, Y director positioning; X-ray tube and detector Z positioning.
3.Software setting voltage and current
4.Image settings: brightness, contrast, auto gain and exposure
5.The user can set the program switch pause time

6.Anti-collision system can meet the maximum tilt and observe objects

Typical X-Ray Applications:

1> 2D imaging

2> Color image

3>Circuit Board Inspection.Circuit board testing automated testing of BGA welding area, bubbles and air (Open), short circuits, offset, round, Tin lost the ball.

Bridging, standard BGA bridge (cause: solder paste too much solution: check the press machine)

Cold Solder, Standard BGA Cold Welding (Possible Cause: No Melting Temperature Solution: Check Reflow )

Check the solder paste, BGA open (Possible reasons: solder printing problems, solder missing, poor solderability. Solution: Check the press)

4>Semi-Conductor,Internal wire bonding inspecetion

5>Inspection ofinternal part of a capacitor.

6> Lithium battery detection.Measuring the distance between the cathode and cathode of the lithium battery

7>Detection of electric heating tube

Check the quality of the resistance wire inside the heating tube