Ormecon Chemical Tin

Ormecon immersion tin is a method for chemical tin plating of copper surfaces. 
The special on Ormecon process is a 0.08 micron thick layer of organic metal, which optimally prepares the surface for subsequent tinning and then prevents the 'diffusion of copper through the tin. 
Ormecon ® CSN meets all modern requirements for PCBs:

• completely planar surfaces for SMD technology
• high storage capacity of bare printed circuit board
• Energy and cost savings compared to HASL
• can be used in basket systems without a major investment
• suitable for horizontal production lines
• protects the environment
• simple process control and monitoring
• all common solder and assembly print varnishes are processed

Additionally Ormecon ® CSN offers the following advantages over other chemical-tin methods:

• Deposition of pure tin
• Up to 50% longer service life of the tin bath
• significant reduction of the diffusion layer
• protection against oxidation • mulitiple, including interim storage, possible
• Rating: 4 hours ageing 155 ° C, 3 x reflow, 1 x Shaft

Equipment:

PROTEC 2030 
PROTEC is ideally suited to the Ormecon chemical tinning procedure. The standard machine can process plates up to 200 x 300mm and contains 5 pools for Microetch, combined spray- and static rinse , Organic metal, chemical tinning 7001, hot rinse

Additional options:

Plate size 300 x 400mm 
Bath movement 
Pools for Cleaning Step 
Pool for DI rinse

further links:

-> Compacta 30

-> Compacta 40

-> Favorit

-> Compacta Ni-Au

-> Protec
-> Accessories