Ormecon immersion tin is a method for chemical tin plating of copper surfaces.
The special on Ormecon process is a 0.08 micron thick layer of organic metal, which optimally prepares the surface for subsequent tinning and then prevents the 'diffusion of copper through the tin.
Ormecon ® CSN meets all modern requirements for PCBs:
Additionally Ormecon ® CSN offers the following advantages over other chemical-tin methods:
PROTEC is ideally suited to the Ormecon chemical tinning procedure. The standard machine can process plates up to 200 x 300mm and contains 5 pools for Microetch, combined spray- and static rinse , Organic metal, chemical tinning 7001, hot rinse
Plate size 300 x 400mm
Pools for Cleaning Step
Pool for DI rinse