The easiest, quickest and cheapest way to protect your pcb is to dip into a Bungard Sur Tin solution. A thin layer of copper will be exchanged with tin. Adhesion and IMC will take place directly on the copper.
Components can be fixed by soldernig or press-fit-connection.
Thickness 0,8 – 1,2 µm
Suitable for lead free soldering
Not suitable for multiple soldering
Storage time 12 months, solderability 6 months
can be retinned any time
Perfect planarity for SMT application
Suitable for fine line technology
Suitable for compliant pin (press-fit) connection
Scope of delivery:
Sur Tin Part 1, Part 2 und Part 3
airtight container (can also be used to prepare solution)
Tinning bowl Bungard processing dish
Shelf life of prepared solution:
By absence of air: several weeks