26/87 Nguyễn Khang, P. Yên Hòa, Q. Cầu Giấy, Hà Nội.
maitek@maitek.vn
0906182358

Gợi ý từ khóa:
maitek, bungard, CCD2, CCD ATC, CCD MTC, SMT, PCB

Bungard Elektronik GmbH & Co.KG

Hệ thống mạ điện phân Bungard Hitec Plate 2030

Mã sản phẩm: Hitec Plate 2030

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Chính sách

Giao hàng toàn quốc

Bảo hành 12 tháng theo tiêu chuẩn nhà sản xuất

Cam kết

Hàng mới 100%, chính hãng sản xuất.

Cung cấp đầy đủ chứng từ, hóa đơn, CO, CQ theo yêu cầu

Giao hàng miễn phí toàn quốc với đơn hàng >10 triệu

Hỗ trợ tư vấn, kỹ thuật 24/7

Chi tiết sản phẩm

HitecPlate2030

Thông số kỹ thuật

	HitecPlate2030
*Chức năng*	Hệ thống mạ điện phân xuyên lỗ (PTH)
Vùng làm việc [mm]	210x300
Nguồn cấp	230 V AC, 50-60Hz
Công suất tiêu thụ [W]	1500
Dung tích các bể xử lý [l]	10
Dung tích bể mạ [l]	30
Trọng lượng [kg]	130
Chiều cao máy [mm]	1365
Chiều cao làm việc [mm]	1000
Bề sâu [mm]	750
Bề rộng [mm]	1810
Ống dẫn nước vào[mm]	13mm Tülle
Ống dẫn nước ra [mm]	25mm Tülle

Chu trình qua các bể như sau:

Bath 1: Rửa sạch

Bể 1 được gia nhiệt tới 70 ° C trong quá trình này

Hệ thống rửa tuần hoàn.

Bath 2: Tạo mầm:

Bath 3: Xúc tác

Hệ thống rửa tuần hoàn.

Bath 4: Tăng cường

Hệ thống rửa tuần hoàn.

Bath 5: Bể dự phòng

Bể này có thể dùng để mạ thiếc (SUR-Tin) tại nhiệt độ phòng hoặc dùng để rửa bằng nước khử ion (DI water ). Trong trường hợp chưa sử dụng sẽ đổ đầy bằng nước.

Bath 6: Mạ đồng

Cố định các điện cực trên thanh gá điện cực, sử dụng túi để bao các điện cực đồng lại và dùng chốt khóa các điện cực cố định.

Hóa chất mạ đồng cho bể 6 sẽ được pha ở ngoài trước khi cho vào máy.

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Mã sản phẩm: chưa rõ
Thương hiệu: Martin
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Mã sản phẩm: chưa rõ
Thương hiệu: Martin
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Mã sản phẩm: chưa rõ
Thương hiệu: Martin
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Mã sản phẩm: chưa rõ
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Bungard Elektronik GmbH & Co.KG

Hệ thống mạ điện phân Bungard Hitec Plate 2030

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