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Lò gia nhiệt cỡ nhỏ MINIOVEN 05

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Chi tiết sản phẩm

MINIOVEN 05

Compact hybrid reflow oven
For reball and reflow processes on BGA, CSP and QFN components at the best temperature distribution.

The MINIOVEN 05 is a compact and robust table-top device specially designed for reballing of BGAs and prebumping of QFN components. The device is used in development and production. The efficient hybrid heating technology heats up electronic components evenly from all sides and thereby guarantees reproducible reballing results. Up to 25 heating profiles can be set up, administered and saved through the intuitive menu navigation.An additional external temperature sensor is used to ensure the highest possible reliability as the device automatically adjusts the reballing profiles. Through the sensor, the optimal profile settings for achieving the specified component temperatures are determined through the sensor. The EASYBEAM software allows for the convenient editing of reballing profiles as well as for the temperature history to be depicted. Aside from the reballing process for BGA components, there are also images and provisions available for the prebumping of QFN components. The device possesses a connection for process gas. This allows the reflow processes to be easily converted to nitrogen-based atmospheres.

Product variants in the shop

HB00.0025 MINIOVEN 05, 230 V

x 1 auf Anfrage

Minioven-05-Perspektive01

HB00.0027 MINIOVEN 05, 115 V

x 1 auf Anfrage

 

Content

  • MINIOVEN 05 Base Unit
  • Sensor for temperature (K-Type)
  • Cutter knife
  • SMD hook
  • Cleaning pen with three spare inserts
  • Capton tape
  • Magnifier
  • Power cable
  • Manual

Technical details

Power consumption:

550 VA

 

Power heating system:

500 W

4 x IR-lamps

Size heating system:

105 x 130 mm2

 

Number of temperature sensors:

1 x internally inst. & 1 x external opt.

 

Number of profiles:

25 memory slots

 

Max. component size:

55 x 55 x 4 mm3

 
 

Mains:

1 Phase, 230 VAC

 

Dimensions:

150 x 300 x 85 mm3

 

Downloads

Device flyer 1.1 MB 

Download

 

modules & attachments

HB00.4005 Process Gas Connection Set

x 1 auf Anfrage

martin-image-placeholder

HB00.0112 Switch Box Process Gas

x 1 auf Anfrage

Martin-420-Solder balls

VD90.5104 Solder balls, 250µm (=3g), 50,000 pc

x 1 auf Anfrage

Martin-420-Solder balls

VD90.5101 Solder balls, 762µm (=86g), 50,000 pc

x 1 auf Anfrage

Martin-4304-Flux Pen lead free

HT00.0009 Flux Pen lead-free

x 1 auf Anfrage

CÔNG TY TNHH CÔNG NGHỆ MAITEK VIỆT NAM
CÔNG TY TNHH CÔNG NGHỆ MAITEK VIỆT NAM