MINIOVEN 05

Compact hybrid reflow oven
For reball and reflow processes on BGA, CSP and QFN components at the best temperature distribution.

The MINIOVEN 05 is a compact and robust table-top device specially designed for reballing of BGAs and prebumping of QFN components. The device is used in development and production. The efficient hybrid heating technology heats up electronic components evenly from all sides and thereby guarantees reproducible reballing results. Up to 25 heating profiles can be set up, administered and saved through the intuitive menu navigation.An additional external temperature sensor is used to ensure the highest possible reliability as the device automatically adjusts the reballing profiles. Through the sensor, the optimal profile settings for achieving the specified component temperatures are determined through the sensor. The EASYBEAM software allows for the convenient editing of reballing profiles as well as for the temperature history to be depicted. Aside from the reballing process for BGA components, there are also images and provisions available for the prebumping of QFN components. The device possesses a connection for process gas. This allows the reflow processes to be easily converted to nitrogen-based atmospheres.

Product variants in the shop

Content

• MINIOVEN 05 Base Unit
• Sensor for temperature (K-Type)
• Cutter knife
• SMD hook
• Cleaning pen with three spare inserts
• Capton tape
• Magnifier
• Power cable
• Manual

Technical details

Downloads

modules & attachments