Cost-effective compact batch reflow oven provides forced air convection heating technology with individual time and temperature controls to make profile set up quick and easy. The single zone GF-B-HT comes in a table-top configuration or with an optional stand. It has a high temperature model capable of lead and lead-free soldering and 2 cooling stations making it the best reflow oven for the money.
This unique PCB shuttle system enables a higher throughput than standard batch ovens. Both sides of the oven have a cooling station. While one board is being processed, another board can be cooled and off-loaded, then a third board can be loaded and shuttled into the chamber for reflow.
Max board width | 12" x 12" (305mm x305mm) |
Max board height | 1.250" (32mm) |
Heating zones | One (1) |
Max temperature | 315°C (600°F) |
Heat tunnel length | NA |
CyclonicsTM (forced air) | One (1) |
Conveyor extensions | Dual board shuttle |
Cooling station(s) | Two (2) |
Venting | 4" (102mm) flange with integral fan |
Cooling Zone Venting | N/A |
Nitrogen option | Yes |
PC Interface | No |
Overall dimensions (L x W x H) | 38.13" x 28.13" x 14.5" (968mm x 715mm x 368mm) |