Còn hàng

Máy hàn chip set BGA tự động ZM-R6810

Máy hàn chip set BGA tự động ZM-R6810
Tình trạng: Hết hàng |Thương hiệu: Shenzhen Zhuomao Technology Co., Ltd
Smart automatic BGA rework station ZM-R6810,reballing bga machine for ps3,laptop,xbox360
Main Features:

1. There are 3 independent heaters. The 1st and 2nd hot-air heaters can control
Liên hệ
Số lượng:
Ưu đãi Ưu đãi
Với các khách hàng đã từng mua hàng tại MAITEK CO.,
Với các khách hàng lần đầu mua hàng tại MAITEK CO.,
Chính sách bán hàng
Hàng chính hãng, bảo hành toàn quốc
Hàng chính hãng, bảo hành toàn quốc
Cung cấp đầy đủ chứng nhận CO, CQ
Cung cấp đầy đủ chứng nhận CO, CQ
Gọi lại trong 10 phút từ khi nhận liên hệ
Gọi lại trong 10 phút từ khi nhận liên hệ
Giao hàng toàn quốc nhanh chóng
Giao hàng toàn quốc nhanh chóng
Hỗ trợ dịch vụ 24/7
Hỗ trợ dịch vụ 24/7
Hỗ trợ mua hàng
Hỗ trợ mua hàng 0906182358

Thông tin chi tiết

Main Features:

 

1. There are 3 independent heaters. The 1st and 2nd hot-air heaters can control multiple groups and segments temperature parameters. The 2nd heater can move up and down. The 3rd large area IR heater can preheat the PCB board fully to ensure no deformation to the board. Temperature, time, slope, cooling, alarming all can be displayed on the touch screen.

2.  High-precision K-type thermocouple with closed loop control, automatic temperature compensation system, combined with Panasonic PLC and highly sensitive temperature module for the precise temperature control, the temperature error controlled within ± 2 degree, The external 4-5 sensors can detect temperature precisely, analyze and calibrate the real temperature curve accurately.

3. V-groove PCB support, rapid positioning, convenience, accuracy, can fit for all kinds of PCB board.

4. Flexible and removable universal fixture has protective effects and no damage to the PCB board, suitable for all kinds of BGA repair.

5. The top heater device and mounting head are integrated design and ball screw drive. Z-axis movements are controlled by Panasonic servo system which can accurately control the site and hotspots, with different size alloy BGA nozzles, 360 degree rotation, easy to install and replace, customized is available; Laser positioning function is optional.

6. High-definition CCD color optical vision system, splitting, amplification, micro-adjust and auto-focus; with automatic color resolution and brightness adjustment device; it can adjust the definition of the image manually;

7. Without changing the magnification, the optical lens can be moved manually left and right, back and forth freely. It can observe all aspects of the BGA chip. It displays clearly. The X, Y axis and R angle with micrometer adjust, precise positioning, alignment accuracy is within ± 0.01MM, 15 〃TFT LCD Monitor.

8.  CE certification, with emergency switch and automatic power-off protection device when emergency happens; with protective mesh to prevent components drop and human burned.

9.  Mounting, welding and dewelding process are intelligent controlled and work automatically, BGA mounting position is controlled accurately, after finishing desoldering and soldering with a double over-temperature protection, there is alarming. When temperature goes out of control, the circuit w automatically power off.

10. It can save multiple groups profiles. You can analyze, set and calibrate the temperature parameters curve on the screen at any time. You can print, save and analyze the curve through the USB port without other external devices (such as computer).

11. Powerful cross-flow fan to cool the PCB board automatically after desoldering and soldering, it can prevent the deformation of PCB board to ensure the welding effect.

12.human-machine interface, high-definition touch screen(Taiwan), PLC control, password protection and calibrate function, can save multiple profiles, instant curve analysis function.

13. With Multifunctional and humanized operation interface, there is "set up Interface" and "operation interface" on the touch screen to prevent wrong operations and setting; Temperature parameter has password protection to stop arbitrary changes.

14. This machine is equipped with pressure and optical sensors. To control the pressure in 3-10 grams and optical switches, so that it can automatically recognize the suction chip and mounting height, to ensure not crush BGA chip. It can repair Socket775 and double BGA / CGA / IC and various shielding devices, meet the requirement of lead-free process.

 

1

Total Power

6750W

2

Top heater

1200W

3

Bottom heater

2nd  heater 1200W,3rdIR heater 4200W

4

power

AC220V±10%     50/60Hz

5

Dimensions

L900*W680*H900 mm

6

Positioning

V-groove, PCB support can be adjusted in any direction and with external universal fixture

7

Temperature

control

K-type thermocouple (Closed Loop), heating independently, temperature precision within ±2 degree

8

PCB size

Max 400*450mmMin 10*20 mm

9

Electrical

materials

Servo Drive(Panasonic)+Touch screen( Taiwan)+Panasonic PLC+Heating plate(Germany)

10

Camera

magnification

10x-100x

11

Optical system

Japanese original high-definition CCD color imaging system

12

BGA chip

1×1-80×80mm

13

Touch screen

7.0〃, Resolution 640X480, Panel Visa touch screen, external USB interface

14

External temperature sensor

Four

15

Work Mode

Power drive

16

Placement Accuracy

X, Y axis and the R angle with micrometer adjust, accuracy within ± 0.01MM

17

Net weight

85kg

 

 

Copyright © 2022 MAITEK CO., LTD. All Rights Reserved. Cung cấp bởi Sapo.
Lên đầu trang
CÔNG TY TNHH CÔNG NGHỆ MAITEK VIỆT NAM CÔNG TY TNHH CÔNG NGHỆ MAITEK VIỆT NAM CÔNG TY TNHH CÔNG NGHỆ MAITEK VIỆT NAM
Trang chủ Danh mục Liên hệ Tài khoản Giỏ hàng