Name: Dual trackin-line 3D Solder Paste Inspection
Model: InSPIre-686DL
Specifications: Dual-track
Size: 450 x350 mm (Detection area)
Inspection Principle: Programmable phase contour modulation measurement techniques(PSLM PMP)
Inspection type:Volume, area, height, XY offset, shape, etc.
Defect Types:shift, excessive solder, insufficient solder, offset, deformed shape, etc.
Smallest componet: 01005.
Accuracy: XY=10 um,Height = 0.37 um.
Repeatability: height:≤1um (4 Sigma);volume/acreage:<1%(4 Sigma).
Maximum Loading PCB Size(X*Y):630x550mm.
Inspection Speed: 0.35 SEC/FOV.
Fiducial Detection Time: 0.3sec/piece.
Maximum inspection height:±450um(±1200umOption).
RGB Tune patented technology.
D-lighting patented technology.
Dynamic and static warpage compensation.
Barcode function with traceability.
Closed loop to printers.
Badmark transfer function to mounters.
Access IMS system functions.
Operating System Support: Windows 7 Professional (64 bit).
Five-minute programming, one-click operation.
SPC process control.