Name: in-line 3D Solder Paste Inspection
Model: Ultra
Specifications: monorail
Size: 510 x505 mm (Inspection area)
Defect Inspection:Volume, area, height, XY offset, shape, etc.
Defect Types:shift, excessive solder, insufficient solder, offset, deformed shape, etc.
Smallest component size: 008004.
Accuracy: XY=10 um,Height = 0.37 um.
Repeatability: height:≤1um (4 Sigma);volume/acreage:<1%(4 Sigma).
Maximum Loading PCB Size(X*Y): 480x490mm.
Ultra-high frames and high precision industrial camera.
Linear encoder.
Professional of GPU image processing.
Inspection Speed: 0.35 SEC/FOV.
Fiducial mark Detection Time: 0.3sec/piece.
Maximum inspection height:±450um (±1200umOption).
High precision industrial camera with high frame count.
RGB Tune patented technology.
D-lighting patented technology.
Dynamic and static warpage compensation.
Barcode function with traceability.
Badmark transfer function of placement machine.
Access IMS system functions.
Operating System Support: Windows 7 Professional (64 bit).
Five-minute programming, one-click operation.
SPC process control.