Name: in-line 3D AUTOMATED OPTICAL INSPECTION
SIZE: 450 x450 mm (inspection area)
Inspection Principle: Sine white projection PMP inspection
Defect inspections: Missing parts, offset, rotation, three-dimensional polarity, upside down, OCV , side standing, tombstone, poor soldering, etc.
Solder inspection: Solder tip, solder volume percentage, excessive solder, insufficient solder, bridge, hole plugging, solder filet, pad contamination, etc.
Smallest component: 01005.
Accuracy: XY (Resolution)：10um.
Repeatability: height：≤1um （3 Sigma）;volume/acreage：<1%（3 Sigma）.
Maximum Loading PCB Size(X*Y): 450x450mm.
Inspection Speed: 0.45 SEC/FOV.
Mark-point Detection Time: 0.5sec/piece.
Maximum height of component on PCB: 50mm.
MaximumPCB Warpage: ±5mm.
Operating System Support: Windows 10 Professional (64 bit).
Equipment Dimension and weight: W1000xD1174xH1550.